The equipment is used for...
– The use of picosecond laser, ultra-short pulse processing, no thermal effect
– Using the state of art laser technology to increase the productivity efficiency to 200%, The maximum fabrication efficiency is up to 20000 hole/s
– Minimum aperture 10μ m, roundness 95% above, hole edge neat and smooth, no thermal effect, burr and other phenomena
– CCD vision pre-scan, mark point, contour positioning, XY platform splicing accuracy 3 μm
– To support a variety of visual positioning features, such as heart circle, hollow circle, cross, l-shaped right Angle edge, image fe
– Automatic loading and unloading sysun teman , ned operation
– HDI, PCB, FPC industry drilling, blind hole
– Ceramic, glass and other hard brittle material drilling
– Micro drilling for TSV process in semiconductor microelectronics industry
– Polymer film, special metal drilling
