The equipment is used for...
– Independent research and development, with international advanced level
– Using pico-second/femtosecond laser as cutting tool, cutting lines of superior quality (optional: multi-focus cutting head), no contact processing stress, can improve the quality of grain cutting and cutting efficiency
– High processing quality, good beam quality, suitable for precision, fine scribing, effectively reduce chip back collapse chipping and microcrack
– Spot size: 1-3μm
– Ceramic plate: 2-8 inch, 8-12 inch
– Accuracy: ≤ ± 1μ m with auto fixing and online monitor
– Power auto compensation
– Auto measuring height and compensation
– Modular design and deep customize every modules
– Film expand and wafer cleavage quipments are optional selected
– Suitable for semiconductor and wafer cutting
